Electrochemical Micromachining for Nanofabrication, MEMS and Nanotechnology

1. Introduction2. Electrochemical Machining: Macro to Micro3. Principle of Material Removal in EMM4. Types of EMM5. Electrochemical Micromachining (EMM) Setup6. Design and Development of Micro Tools7. Influencing Factors of EMM8. Improvement of Machining Accuracy9. Advantages, Applications and Limitations of EMM 10. Micro-Features Fabrication for MEMS and Other Microengineering Applications11. Electrochemical Micro System Technology (EMST)12. Recent Advancements in EMM for Nanofabrication13. Nano-Features on Metals and Semiconductors for Nanotechnology Applications

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• Outras tecnologias de produção
• Electroquímica e magnetoquímica

3D EMM; anodic dissolution; Atomic force microscope (AFM); Back-side illumination electrochemical etching (BIEE); Butler-Volmer equation; Cathodic accumulation; Cavitation; Charge transfer resistance; Complex internal microfeature; Conical microtool; Current distribution; Current efficiency; Delocalization; Die-sinking EMM; Double-layer capacitance; Drop-off method; Duty ratio; ECM; ECM setup; Eco-friendly electrolyte; EDM; Electrical circuit for EMM; Electrical double layer; Electrochemical deposition; Electrochemical microcell; Electrochemical micromachining (EMM); Electrochemical microsystem technology (EMST); Electrochemical nanocell; Electrochemical nanolithography (ENL); Electrochemical nanostructuring; Electrochemical nanotechnology (ENT); Electrochemical printing; Electrochemical reactions; Electrochemical wet stamping (E-WETS); Electrochemistry; Electrolysis; Electrolyte for EMM; Electrolyte resistance; Electron transfer reactions (ETR); EMM for MEMS; EMM power supply; EMM setup; EMM techniques; EMM tool; EnFACE technology; Faraday's law; Focused ion beam (FIB); Galvanic deposition; Helical microrecesses; High aspect ratio microfeatures; High-aspect-ratio microstructures; Hybrid EMM; Interelectrode gap (IEG); Interelectrode gap control; Ion transfer reactions (ITR); Jet EMM; Joule's law; Layer-by-layer EMM; Limiting current density; Localization; Localization of reactions; Machining accuracy; Machining current; Machining voltage; Maskless EMM; Mass transfer; Mass transport; Material advantages; Mechanical machining unit; Mechanism of material removal; Metallic pillars; Micro tips; Micro-EC milling; Microcantilevers; Microcavities; Microchannels; Microdrilling; Microelectrode; Microelectromechanical systems (MEMS); Microengineering; Microfeatures; Microgrooves; Microholes; Micromachining; Micronozzles; Micropattern; Microreactions; Microslitting; Microsparks; Microstructures; Microsystems; Microtool fabrication; Microtool vibration; Micrototal analysis system (I1/4TAS); Miniaturization; Nanofabrication; Nanomachining; Nanometer features; Nanoscopic localization; Nanoscopic metal-insulator-metal (MIM) structures; Nanotechnology; Nernst equation; Oxide film layer lithography (OFLL); Oxide layer; Passivation; Pattern transfer; Polarization; Porous aluminum oxide; Porous-type anodization; Pourbaix diagram; Process parameters; Profiled microhole; Pulse generator circuit for EMM; Pulsed DC power supply; Reverse ECM; Scaling down; Scaling up; Scanning electrochemical microscopy (SECM); Scanning probe microscope (SPM); Scanning tunneling microscope (STM); Selective electrochemical dissolution; Semiconductor micromachining; Shape evolution; Single-step die sinking EMM; Sinking and milling EMM; Solid-state electrochemical micromachining (SSEM); Spiral beam; Stray current; Surface engineering; Surface structuring of metals; Taperless microchannel; Through-mask EMM; Titanium; Tool feed rate; Tool insulation; Tool movement; Transport mechanism; Ultrasonic vibrations; Unit removal; Usability of microtools; Warburg impedance; Wire electrochemical machining (WECM); Wire electrochemical turning; Wire electrodischarge grinding (WEDG)