TSV 3D RF Integration
-10%
portes grátis
TSV 3D RF Integration
High Resistivity Si Interposer Technology
Jin, Yufeng; Ma, Shenglin
Elsevier - Health Sciences Division
04/2022
292
Mole
Inglês
9780323996020
15 a 20 dias
630
Descrição não disponível.
1. Introduction to HR-Si Interposer Technology 2. Design, process and electrical verification of HR-Si interposer 3. Design, verification and optimization of novel vertical RF transmission structure in HR-Si interposer 4. HR-Si TSV integrated inductor 5. Verification of 2.5D/3D heterogeneous RF integration of HR-Si interposer 6. 3D heterogeneous RF integration oriented HR-Si interposer embedded with microchannel 7. Patch Antenna in Stacked HR-Si interposers 8. Through Glass Via Technology 9. Conclusion and outlook
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TSV; TGV; IPD; Microfluidic cooling; TR; silicon; microelectronics; 5G
1. Introduction to HR-Si Interposer Technology 2. Design, process and electrical verification of HR-Si interposer 3. Design, verification and optimization of novel vertical RF transmission structure in HR-Si interposer 4. HR-Si TSV integrated inductor 5. Verification of 2.5D/3D heterogeneous RF integration of HR-Si interposer 6. 3D heterogeneous RF integration oriented HR-Si interposer embedded with microchannel 7. Patch Antenna in Stacked HR-Si interposers 8. Through Glass Via Technology 9. Conclusion and outlook
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
